- Major presentation of new developments in materials science and technology
- Applications in metals, composites, and polymers
- Special emphasis on nanomaterials
- 98 participants from 16 different countries
- Illustrations and tables throughout
- Extensive subject index
The International Thermal Conductivity Conference-now in its 27th year- is a major international conference on materials science and technology. Seventy-five outstanding technical papers, from leading materials specialists from around the world, were presented at the conference. Published after the conference, this volume contains the complete edited texts with all tables and figures from the latest conference.
In additional to traditional topics such as thermal insulation, instrumentation and standards, the conference tried to highlight research in carbon nanotubes, nanomaterials, novel thin films, thermoelectric and composites. Thermal expansion measurements using X-ray and neutron diffraction methods were presented for the first. The conference highlighted the fact that conductivity and thermal expansion are playing important roles in advanced material research.
The conference was chaired by Hsin Wang and Wallace D. Porter from the Oak Ridge National Laboratory which was the sponsor of the Conference. This publication also includes papers presented by The 15th International Thermal Expansion Symposium which was held concurrently with the Thermal Conductivity Conference.
